Such adhesives are of high interest as substitutes for the environmentally destructive lead-solder interconnects that are now routinely used in microelectronic packaging applications. Fundamentally they are composed of an epoxy or other polymer resin, with an electrically conductive filler, but the combination and proportions of materials can vary considerably. Electrical, mechanical, and chemical engineers and scientists explore recent developments, mechanical durability and reliability aspects, and characterization and properties. Among specific topics are anisotropic conductive adhesives for flip-chip interconnects, aspect ratio and loading effects of multi-wall carbon nanotubes in epoxy, the chemorheology of epoxy/nickel conductive adhesives during processing and cure, and electrical properties of copper-filled adhesives and pressure-dependent conductive behavior of copper particles. There is no index. VSP is a subsidiary of Brill. Annotation ©2009 Book News, Inc., Portland, OR (booknews.com)