A complete guide to the science and technology of Physical Vapor Deposition (PVD) process technology firmly grounded in the author's practical experience, gained in R&D, the manufacturing environment, consulting and teaching short courses.<BR><BR>This book covers all aspects of Physical Vapor Deposition (PVD) process technology from characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to reproducible deposition of films that have the desired properties.<BR><BR>This book covers both widely discussed subjects such as vacuum technology, film properties, and the fundamentals of individual deposition processes and neglected areas such as film adhesion, substrate surface characterization, and the external processing environment. The author relates these subjects to the practical issues that arise in PVD processing, such as contamination control and substrate property effects on film growth, which are often not discussed or even mentioned in other literature. By bringing these subjects together in one book, the author has made it possible for the reader to better understand the interrelationship between various aspects of film deposition processing and the resulting film properties.<BR><BR>Don Mattox draws upon his long experience with developing PVD processes and products, troubleshooting the processes in the manufacturing environment, consulting, and teaching short courses on PVD processing, to not only present the basics but to provide useful hints for avoiding problems, and solving problems when they arise.<BR><BR>This second edition covers recent technical developments such as the introduction of HIPIMS and HIPIMS+, the increased use of chemical vapor precursors in reactive PVD processing, and the increased development of thick and nanolayered PVD coatings, particularly for tribological applications. The increasing importance of gas/vapor flow and control in reactive PVD and PECVD processes is reflected in the addition of a new Chapter on The Sub-Atmospheric Processing Environment.