In this collection of 16 extended articles and monographs, contributors and editors have substantially updated content to keep current with changes in nomenclature, materials, practices and technologies since the first edition (date not cited). They address the basics of the functions of an electronic package and the driving forces in technology, then describe materials used in microelectronic packaging. Coverage include properties and analysis of ceramics, polymers, and metals; organic printed circuit board materials and processes; modeling and simulation; thermal and mechanical design considerations; packaging of MEMS and MOEMS (including a case study); and reliability, cost evaluation analysis, among other topics. Although intended for graduate-level classroom use (including exercises for each section), this can double as a desk reference. Annotation ©2006 Book News, Inc., Portland, OR (booknews.com)