Reviews the current status of high performance polymers, in particular polyimides, in the electronics industry. Overviews polymers used for optical lithography, semiconductor encapsulation, packaging, flexible circuitry, and conformal coatings, then examines development of new polyimides for their electrical and optical properties, adhesive strength, thermal expansion, and moisture and solvent diffusion. A chapter is devoted to chemistry of negative and positive photosensitive polyimides. Attention is also paid to process parameters used for deposition techniques, cure cycles, and etching methods. Rabilloud is affiliated with the Centre d'Ttudes des matTriaux organiques pour les technologies avancTes. Annotation c. Book News, Inc., Portland, OR (booknews.com)