A comprehensive guide addressing aspects of the failure modes and mechanisms that are essential to the success of today's highly complex electronic products. The text illustrates the fundamental causes of failures such as design, materials, and manufacturing processes; offers prevention methods through failure analysis; and provides design, material, and process improvements in electronics packaging. A detailed account of the failures of device packages, discrete components connectors, PCB carriers, and PCB assemblies are presented. In addition, examples of failures commonly observed in the packaging industry, as well as surveys of various failure models, are outlined. Annotation c. by Book News, Inc., Portland, Or.